Fabrication method for liquid crystal cell

ABSTRACT

A liquid crystal cell fabrication method is presented that utilizes a deposited metal gasket moisture barrier bonding two opposing plates of glass each having a spacer layer to accurately control cell gap thickness along with an optional integrated thermal sensor and heater deposition layer sandwiched between both opposing plates of glass.

FIELD OF INVENTION

[0001] This invention relates generally to optical liquid crystalsystems. More particularly, it relates to fabrication methods for aliquid crystal cells, including cells integrated with opticalnanostructures.

BACKGROUND OF THE INVENTION

[0002] Optical nanostructures have been the object of scientificinvestigation for several years but advances in material science andimprint lithography have only recently resulted in their cost effectivemanufacturing and availability as optical components in industry.

[0003] Optical nanostructures derived with feature sizes below thewavelength of light are known to have uniform behavior over a broadwavelength, wide acceptance angles and unique optical properties as afunction of varying dimensions of their underlying grating features. Thephysical interaction of light with the nanostructure obeys theapplication of physics of diffraction gratings, but the scale of thestructure causes changes in the boundary effects. As a result, quantumeffects influence the classical optical effects of reflection,refraction and diffraction, resulting in nanostructure's unique opticalproperties. Recently, a nanostructure has been created to function as apolarizing beam splitter that performs as a perfect mirror for incidentlight with the light polarized parallel to the nanostructure and aperfect window with light polarized perpendicular to the nanostructure.By comparison to traditional optics, the aforementioned nanostructuredpolarizing beam splitter has been demonstrated to perform with 180degrees of beam separation in a package size under one millimeter versustwo degrees of separation for a 15 millimeter length of birefringentcrystal. Generally, nanostructures exhibit such unique opticalproperties as a result of having feature sizes in the hundreds ofnanometers to tens of nanometers, below the wavelength of incidentlight, eliminating all high-order diffractive modes and operatingexclusively on zero—order diffraction properties.

[0004] As a result of thier low cost of manufacturing, unique opticalproperties, high performance and miniature form factor, opticalnanostructures represent a promising new technology that will have broadramifications to tomorrow's optical systems.

[0005] Realizing the performance and value of optical nanostructures istantamount to overcoming the primary challenge of integrating theseoptical structures into other optical elements. Nanostructures may beheterogeneously or monolithically integrated with other opticalelements, integrated as thin-films placed adjacent to, affixed to, orinserted into other optical components such as lasers, planar lightwavecircuits and liquid crystal devices. The challenge of integratingnanostructures with other optical elements and obtaining theextraordinary performance and scale benefits is a serious undertakinggiven that the integrated structure will carry a performance metricbased on the additive sum optical properties of the two individualstructures plus any distortion caused by the interface of thenanostructure and optical element. As a result, the performance ofintegrated structures usually do not offer the same level of highperformance provided by the nanostructure alone. There is a strong need,therefore, to increase the performance of the underlying opticalelements targeted for integration with sub wavelength optical elements.

[0006] Liquid crystal technology is known to be dynamically controlledand configured to enable a range of optical switching and signalconditioning applications. Formed with opposing plates of sealed glass,liquid crystal cells are considered a prospect technology andintegration target capable of supplying the active layer to ananostructure integrated therewith. Wang et. Al has recentlydemonstrated an experimental electrically tunable filter based on awaveguide resonant sub-wavelength nanostructure-grating filterincorporating a tuning mechanism in a thin liquid crystal. The deviceexperiment was functional and exhibited performance of 30 nanometertuning.

[0007] It is generally known that the performance of liquid crystaltechnology is susceptible to temperature and humidity change, and thathigh humidity and temperature changes cause decreased opticalperformance, resulting in high insertion loss and low extinction, twocritical measures of a cell's performance.

[0008] The speed performance and optical characteristics of the liquidcrystal medium as a function of applied electric field varies withtemperature. In a liquid crystal cell relatively modest changes intemperature can result in relatively large changes in the transmissionof light, index of refraction, and the speed of the liquid crystal statechanges. FIG. 1 shows the temperature influence of a liquid crystal cellindex of refraction across voltage. FIG. 2 shows that voltage for aselected transmission of light in one temperature range will provide adifferent transmission of light at different temperatures. FIG. 3 showsthe relationship between temperature and the amount of time it takes aliquid crystal cell to change states, which decreases with increasedtemperature. FIG. 3 also shows that switching times of liquid crystalcells are sensitive to cell gap thickness. The series represented in thefigure are two cells each having different gap sizes. More specifically,the faster switching cell has a cell gap 0.4 micron larger than theslower cell. Clearly, size and the effect of the change in opticalproperties are factors in controlling the optical performance in thevarious states of the liquid crystal cell across temperature.

[0009] In order to ensure that the temperature of the liquid crystalmedium can provide stable operation and within a practical responsetime, prior art liquid crystal cells are known to utilize active thermalmanagement systems based on independent temperature sensor and heaterelements. JACKSON et al. relies on a resistive heating element that canbe energized to heat the liquid crystal cell whenever the temperature ofthe cell drops below a predetermined temperature trip point. JACKSONdoes not accommodate feedback to the voltage control of the cell andfails to handle ambient temperature increases above the trip point.McCartney et al. provides a more complete solution that incorporates theoutput of the temperature sensor into a temperature feedback loop toadjust voltage in response to temperature change. In this design, atwo-dimensional lookup table provides the output voltage for anytemperature and pixel attribute combination. McCartney's design,however, does not scale to high resolution optical systems withoutincreasing the size of the lookup table.

[0010] In general, the prior art liquid crystal thermal managementsystems rely on use of individual discreet devices for heating andsensing the liquid crystal cell. These devices are generally affixed tothe outside glass of the cell at disparate locations so they aregenerally incapable of functioning uniformly across the cell. Inaddition, because these devices are usually affixed to the outsideglass, all heating and sensing functions directed to the liquid crystalmolecules on the inside of the glass must be translated through theglass medium. This can result in hysterises and other effects thatdistort the effectiveness of closed loop temperature sensing and heatingsystems. Finally, prior-art liquid crystal cell heaters and temperaturesensors are typically attached to the cell using epoxy resins, and epoxyresins are generally known to absorb moisture in high temperatures andhigh humididty conditions, which leads to degradation or inconsistancyin cell performance.

[0011] The performance of liquid crystal cells are generally verysensitive to moisture and humidity. Prior art liquid crystal seals areknown to provide varying levels of protection of liquid crystal cellsfrom moisture and humidity. The prior art designs generally seal andspace the cell with glass beads, frit and organic polymers such as epoxyresin. Sealing materials are generally disposed, in the form of gaskets,about the periphery of the cell. The advantage of a seal of glass fritis known to be that such seal is practically impervious to gas andvapors, but this approach requires formation by high temperatureprocessing, and high temperature processing tends to distort thesubstrate and render difficult control uniformity of the distancebetween the inner surface of the parallel substrates. This gap(containing the liquid crystal material) must be maintained with a highdegree of uniformity to achieve precise operation of a liquid crystalcell. Accurately controlling the liquid crystal cell gap is keystone toenabling high performance nanostructured liquid crystal optical systemsof the present invention.

[0012] In producing an effective glass frit seal, the frit is generallyapplied to a surface of one of the substrates as a paste of glass powderparticles dispersed in a liquid vehicle. The substrate is subsequentlyheated over a programmed temperature regime wherein, at lowertemperatures, the solvent is evaporated and the binder is burned off,and hence in the higher temperature portions of the regime, the glasspowder itself melts and coalesces to form a strongly adhesive bond tothe glass substrate. Subsequently, the second glass substrate ispositioned over the coalesced frit and the entire assembly is againsubjected to a programmed temperature regime during which thetemperature is raised within a few tens of degrees of the glazingtemperature of the glass frit. At this relatively high temperature, theglass frit wets the second substrate to acquire satisfactory adhesionthereto. It is known that this second heating cycle tends to soften thesubstrates and cause warpage thereof, with the result that cells,particularly those of larger surface area, sealed by this glass fritmethod tend to have a very low percentage of acceptable manufacture.

[0013] It is generally known that warpage during fabrication can beprevented by the alternate use of organic polymer sealants, such asepoxy resins and the like, which can be processed at much lowertemperatures. Polymer sealants may be screen printed from a solution ordispersion of the polymer in a solvent, or a polymer sheet can be cutinto the shape of a gasket which is sandwiched between the substrates tobe sealed, and the sandwich is subsequently heated to effect such seal.It is also known to introduce the polymer along the edges of an assemblyof two substrates which are kept otherwise separated by interiorspacers. However, such organic polymer sealants have a relatively highpermeability to water vapor. Under high temperature and humidityconditions, water vapor permeates into the seal causing the expansion ofthe seal and a shape change in the liquid crystal cavity that results ina change in the known performance of the liquid crystal cell.

FEATURES OF THE INVENTION

[0014] The present invention contain several features that may beconfigured independently or in combination with other features of thepresent invention, depending on the application and operatingconfigurations. The delineation of such features is not meant to limitthe scope of the invention but merely to outline certain specificfeatures as they relate to the present invention.

[0015] It is a feature of the present invention to provide a liquidcrystal cell that may be formed of glass etched with sub wavelengthoptical features.

[0016] It is a feature of the present invention to provide a liquidcrystal cell that may be fabricated with an integrated sub wavelengthoptical nanostructure.

[0017] It is a feature of the present invention to provide a liquidcrystal cell that may be fabricated with an integrated optical element.

[0018] It is a feature of the present invention to provide a liquidcrystal cell that may be fabricated with an integrated polarizer, beamsplitter, polarization beam splitter, waveguide, thin film, filter,mirror, photodetector, isolator, grating, subwavelength grating,combiner, waveplate, nanostructure, or some combination thereof.

[0019] It is a feature of the present invention to provide a liquidcrystal cell platform that can be configured in various applications,including but not limited to telecommunications applications in opticalswitching, variable optical attenuation, tunable filters and wavelengthselection applications.

[0020] It is a feature of the present invention to provide a liquidcrystal cell that may be constructed from materials substantiallyimpervious to moisture.

[0021] It is a feature of the present invention to provide a liquidcrystal cell that may contain a heater and temperature sensor integratedtherein as single physical element and to provide for accurate controlof heating and temperature sensing.

[0022] It is a feature of the present invention to provide a novelmethod of operating a liquid crystal cell across a range of temperaturewithout the need for lookup tables otherwise used to compensate for realtime temperature changes.

[0023] It is a feature of the present invention to provide a liquidcrystal cell that passes the strict telecommunications guidelines asoutlined in Telcordia GR1221 without the need for hermetic housing.

[0024] It is a feature of the present invention to provide an opticallyflat liquid crystal cell and not otherwise prone to warpage duringfabrication process.

[0025] It is a feature of the present invention to provide an opticallyflat liquid crystal cell and not otherwise prone to warpage when exposedto various thermal and humidity atmospheres.

[0026] It is a feature of the present invention to provide a liquidcrystal cell whose thickness may be controlled at nanometer resolution.

[0027] It is a feature of the present invention to provide a novelmethod for fabricating a liquid crystal cell having some or all of thefeatures included therein.

[0028] It is a feature of the present invention to provide a novelmethod for aligning two substrates, including but not limited to thosesubstrates of the present invention.

[0029] It is a feature of the present invention to provide a platformthat may be used in transmissive or reflective liquid crystal cells.

[0030] It is a feature of the present invention to provide a platformthat may be configured into an array of liquid crystal cells.

SUMMARY OF THE INVENTION

[0031] The disadvantages associated with the prior art may be overcomeby a liquid crystal cell and fabrication method directed to a depositedmetal gasket moisture barrier bonding two opposing plates of glass eachhaving a spacer layer to accurately control cell gap thickness. Theliquid crystal cell may include an integrated thermal sensor and heaterdeposition layer sandwiched between or deposited on at least one or bothopposing plates of glass.

[0032] The disadvantages associated with the prior art may further beovercome with a liquid crystal cell control system utilizing a timedivision scheme that multiplexes temperature sensing and heatingfunctions across an integrated active thermal element such that the cellmay generally be kept at a constant temperature. A calibration processcharacterizes the profile of the cell and generates a polynomialregression formula that provides the voltage drive output for atemperature and cell state input. The control system stores the state ofthe liquid crystal cell, the regression formula, and reads thetemperature of the liquid crystal cell to compute and assert thetemperature compensated voltage drive.

BRIEF DESCRIPTION OF THE FIGURES

[0033]FIG. 1 shows one example liquid crystal cell's temperaturedependence and change in index of refraction.

[0034]FIG. 2 shows one example liquid crystal cell temperaturedependence of the attenuation function.

[0035]FIG. 3 shows how liquid crystal cell shutter switching speedschange as a function of temperature and cell gap thickness.

[0036] FIGS. 4A-4D shows various liquid crystal cell embodiments of thepresent invention.

[0037]FIG. 5 shows one process flow for fabricating the liquid crystalcells of the present invention.

[0038]FIGS. 6A and 6B show example indium tin oxide (ITO) electrodeforming masks of the present invention.

[0039]FIGS. 7A and 7B show example integrated active thermal elementforming masks of the present invention.

[0040]FIGS. 8A and 8B show example spacer element forming masks of thepresent invention FIGS. 9A and 9B show example masks for defining ametal gasket element layer of the present invention.

[0041]FIG. 10A shows a top view example integrated perspective showingthe relationship between various layers of the present invention.

[0042]FIG. 10B is an isometric view showing a liquid crystal cell at thetermination of the fabrication process.

[0043]FIG. 11 shows the liquid cyrstal thermal calibration and feedbackloop method flows.

[0044]FIG. 12 shows a block system diagram for the electronic controland thermal management system of the present invention.

DETAILED DESCRIPTION

[0045] Throughout this application, like reference numbers as used torefer to like elements. For instance, the two substrates used to formthe liquid crystal cell of the present invention are referred tothroughout this applications as 110A and 110B. Those supporting elementsand features of the invention that are distributed on each substrate andlater combined may be referred to under their index reference for aparticular substrate ′A, ′B or for simplicity sake, under the sharedreference ′.

[0046] A first embodiment of the present invention is presented in FIG.4A, which shows (not to scale) a liquid crystal cell platform 100 havinga first substrate 110A in opposition to a second substrate 110B. In thisembodiment, the first substrate may contain an inner surface having atransparent conductive electrode layer 104A, liquid crystal alignmentlayer 109A, a metal gasket element layer 106A and spacer element layer107A. The second substrate 110B contains an inner surface having an atransparent conductive electrode layer 104B, a liquid crystal alignmentlayer 104B, metal gasket element layer 106B and spacer element layer107B.

[0047] A second embodiment of the present invention includes anintegrated optical element 111 and is presented in FIG. 4B, which shows(not to scale) a liquid crystal cell platform 100 having a first glasssubstrate 110A in opposition to a second glass substrate 110B whereinthe first substrate contains an integrated optical element 111 on oneside of the substrate, a transparent conductive electrode layer 104A, aliquid crystal alignment layer 109A, metal gasket element layer 106A andspacer element layer 107A on the opposing side, and, the secondsubstrate 110B containing a transparent conductive electrode layer 104B,a liquid crystal alignment layer 109B, metal gasket element layer 106Band a spacer element layer 107B.

[0048] A third embodiment of the present invention is presented in FIG.4C, which shows a liquid crystal cell platform 100 having a first glasssubstrate 110A in opposition to a second glass substrate 110B whereinthe first substrate contains an integrated optical element 111, atransparent conductive electrode layer 104A, a liquid crystal alignmentlayer 109A, a metal gasket element layer 106A, a spacer element layer107A and an integrated heater/temperature sensor element layer 108A. Inthis embodiment, the second substrate 110B contains a transparentconductive electrode layer 104B, a liquid crystal alignment layer 104B,metal gasket element layer 106B, a spacer element layer 107B, and anintegrated active thermal element, heater/temperature sensor layer 108B.

[0049] A fourth embodiment of the present invention is presented in FIG.4D, which shows a liquid crystal cell platform 100 having a first glasssubstrate 110A in opposition to a second glass substrate 110B whereinthe first substrate contains an integrated optical element 111, atransparent conductive electrode layer 104A, a liquid crystal alignmentlayer 109A, a metal gasket element layer 106A, and a spacer elementlayer 107A. In this embodiment, the second substrate 110B contains anintegrated optical element 112, transparent conductive electrode layer104B, a liquid crystal alignment layer 104B, metal gasket element layer106B, and a spacer element layer 107B. In this embodiment, theintegrated optical elements 111 and 112 may provide the same ordifferent functionality, depending on the application. For example, in afree space variable optical attenuator application, a transmissive cell100 might be configured with two polarizers transmitting perpendicularstates of light, 111, 112, respectively. In an optical switchingapplication, a reflective cell 100 may include an optical element 111functioning as a polarization beam splitter and combiner, and opticalelement 112 functioning as a mirror.

[0050] With respect to all embodiments, it is generally preferable thatsubstrate 110 be comprised of glass but other substrate materials,including silicon, polymers, etc., may be suitable depending on theapplication.

[0051]FIG. 5 shows one example fabrication process to create the liquidcrystal cell platform 100. Various optional steps may be omitteddepending on the embodiment of configured features.

[0052] With respect to FIG. 5, optional step one involves integrating anoptical element into at least one substrate. The optical element mayfunction as a polarizer, beam splitter, filter, thin film, polarizationbeam splitter, waveguide, waveplate, combiner, mirror, partiallytranparent mirror, isolator, detector, grating, subwavelength grating,nanostructure, or some combination thereof and including those opticalfunctions presently known in the art. Preferably, the optical element isa nanostructured grating feature, such as those described by NanoOptoCorporation of New Jersey. The grating feature may be applied to orintegrated onto substrate 110A or 110B, or onto both substratesdepending on the application. With respect to process step 201, a glasssubstrate is etched using nanoimprint lithography or similar methodsknown in the field based on impressing a reference mask into photoresist to create surface relief patterns on the substrate where thesurface relief photo resist pattern is etched to form grating featuresin the nanometer range. Alternately, the optical element may be suppliedas a thin film and bonded to the target substrate by way of epoxy orother methods described herein or otherwise generally known. The opticalelement may also be deposited directly on the inner or outer surface ofeither substrate, or both. Finally, the optical element itself may beintegrated into the substrate by way of choice of substrate material.For example, the substrate 110A, 110B or both substrates may be made ofPolarcor, a polarization beam splitter glass made by Corning, Inc.

[0053] Step two involves adding the appropriate ITO patterns to thefirst and second glass substrates to form the liquid crystal electrodes.With respect to process flow 202 of FIG. 5, a standard PECVD process maybe used to apply thin film of ITO approximately 100 angstroms thick.FIGS. 6A and 6B show example ITO masks that may be used to patternsubstrates 110A and 110B, respectively.

[0054] Step three involves adding polyimide alignment layer to the firstand second glass substrates. With respect to process flow 203 of FIG. 5,standard spin coating stepped processes may be used at room temperatureto create a layer of polyimide approximately 600 angstroms thick on eachsubstrate.

[0055] Step four involves patterning the polyimide layer. With respectto process 204, photo resist may first be applied to the substrates andmasked using traditional photolithography techniques or laser etchingmay be used to pattern the substrates. Wet or dry etching performedthereafter may result in a pattern of polyimide.

[0056] Step five involves anchoring the liquid crystal alignment layers.With respect to process step 205, one traditional method is to rub thepolyimide of each substrate to form the alignment layers. In a twistednematic configuration, the rubbing direction of the first substrate maybe orthogonal to the rubbing direction of the second substrate. In anelectronically conductive birefringence (ECB) configuration, the rubbingdirection of the first substrate may be parallel to the rubbingdirection of the second substrate. Various anchoring schemes may bedefine rub angles other than 0 or 90 degrees. An alternate method offorming the alignment layers is to employ an imprint lithographytechnique where a reference mask is pressed onto a deposited photoresist layer to create surface relief patterns in the photo resist whichis subsequently etched to form high precision alignment grooves withnanoscale tolerance.

[0057] Optional step six involves creating the active thermal element,integrated heater and temperature sensor. FIGS. 7A and 7B show examplemasks that may be use with respect to process step 206 of FIG. 5, inwhich a seed adhesion layer of chrome is first deposited approximately200 angstroms thick onto the substrates, followed by a PECVD depositionthin film platinum resistor layer approximately 2000 angstroms thick andforming the upper and lower portions of the integratedheater/temperature sensor. The upper and lower portions of theintegrated device, applied to substrates 110A and 110B, may be separatedby an air gap approximately 9.6 microns and interconnected by VIASformed from a metal deposition step that will be described in succeedingstep eight. Again, it need be stated that gap thickness is delineatedfor example purposes and will change depending on the desiredapplication. It should be stated that, depending on the configuration,the platinum thin film resistor may be patterned in various shapes,including but not limited to arched, curved, circular, zigzag, strippedas well as the serpentine pattern of FIGS. 7A and 7B. Given theresistivity of the thin film platinum, approximately 10.6E-8 ohm meters,the example shown yields approximately 100 ohms resistance at roomtemperature.

[0058] Step seven involves creating the spacer element 107.

[0059] Spacer element 107 controls the gap thickness of the liquidcrystal cell. While it is not necessary to equally distribute the spacerelement equally on each substrate, it is preferred that one half of thedesire gap thickness of the completed cell shall define the thickness ofthe spacer element 107 as deposited on each substrate. The combined cell100 gap thickness may therefore be formed with a tolerance based ondeposition process. Silicon dioxide is the preferred material forcreating the spacer element, however other materials such as aluminumoxide, silicon nitride, silicon monoxide and other materials compatiblewith thin film deposition processes that do not substantially compressmay also be used as an alternative to the silicon dioxide provided theyare compatible with the selected liquid crystal substrate material.FIGS. 8A and 8B show an example mask that may be used to perform theprocess step 207 of FIG. 5, where a patterned layer of 5 microns thickof silicon dioxide is deposited onto each substrate.

[0060] Step eight involves creating the metal gasket element 106. Metalgasket element 108 may be made from a variety of metals, including butnot limited to, indium, gold, nickel, tin, chromium, platinum, tungsten,silver, bismuth, germanium and lead. However it is preferable to useindium because of its pliability and relatively low melting temperature.FIGS. 9A and 9B show example masks that may be used to perform processstep 208 of FIG. 5, where, for the continuing example purpose, a layerapproximately 7 to 9 microns thick of indium may equally be deposited oneach substrate. It is generally preferable that metal gasket layer ofthis process step is deposited thicker than the spacer element of theprevious step due to seepage that occurs during the additionalprocessing steps. Metal gasket masks, such as those shown in FIGS. 9Aand 9B, may be configured to form referential VIAS 300 that enableelectrical interconnection between features deposited on eithersubstrate 110A or 110B. VIAS 300 may also be formed to simplify routingexternal contact pads to the temperature sensor and heating element. Forexample the VIAS 300 of the present example are positioned to overlapthe heater/temperature sensor platinum layer defined in step six. Theyare also positioned to overlap the ITO layer so as to define contactpads to drive the two electrodes of the liquid crystal cell.

[0061] Step 9 involves aligning and pressing wafers 110A together with110B. It is known that visual alignment reference marks may be etchedinto the underlying wafer, or that a physical feature of the glass sheetsuch as an edge or alignment hole may be used to perform waferalignment.

[0062] However, a high yield method of accurately aligning the relativeposition of the two glass substrates without the need for expensive highprecision alignment equipment is hereby presented, in whichcomplimentary interlocking geometric features deposited on eachsubstrate, mate with each other to prevent relative movement of theglass sheets during the bonding and pressing process. Such interlockingfeatures mitigate any non uniformity in the bonding process and giventhat the typical gap between two glass sheets of a liquid crystal cellis less than 20 micrometers, thin film deposition or screening processescan be used to create precisely controlled and repeatable geometricfeatures. With respect to process step 209 of FIG. 5, the substrates110A and 110B may be brought together, aligned under pressure at roomtemperature to form a chemical bond metal gasket at the gap distancedefined by the sandwich spacer elements formed from both substrates.

[0063] Step 10 involves dicing of the wafers. Process step 210 of FIG. 5may be performed using a dicing saw or via etching techniques.

[0064] Step 11 involves removal of a portion of protective glass on theliquid crystal cell. FIG. 10A shows a top perspective of the variouslayers that combine through the substrates when interposed thereuponeach other in a fully configured embodiment of the present invention.With respect to process 211 of FIG. 5, the substrate 110B is scoredusing a diamond dicing saw to cut a trench approximately 90% through thethickness of the substrate and forming the break off line 119 of FIG.10A. A portion of the substrate 110B is broken off along the break offline 119 to define an access surface 113 of FIG. 10B that providesaccess to the underlying liquid crystal electrode contact pads 500 and500′, the underlying liquid crystal heater/temperature sensor elementelectrical contact pads 502 and 502′, as well as to the liquid crystalfill port 115.

[0065] Step 12 involves filling the liquid crystal device with a liquidcrystal molecules, process 212 of FIG. 5. This step may be performedusing traditional methods of filling a liquid crystal cell, whereby thecell is placed in a vacuum, a droplet size of liquid crystal material isplaced at the fill port 115, and with the release of the vacuum,equilibrium pressure forces the liquid crystal material into the fillport 115 and the fill port is plugged.

[0066] Several techniques to cap the fill port, including UV curableepoxy which may be used to close the fill port.

[0067] Electronic Control System

[0068] A block diagram of components directed to a liquid crystal cellsystem and its host controller are included in FIG. 11 along with theliquid crystal thermal management and voltage controller subsystems ofthe present invention, now described in further detail.

[0069] In one example configuration, host computer 400 may be configuredto communicate with microcontroller 402 over a full duplex datainterface and enabling the host computer to engage functions, sendcommands and retrieve data from microcontroller 402. Microcontroller maybe configured to store software control routines. The software controlroutines may function to adjust voltage drive provided to the liquidcrystal cell in response to temperature fluctuations.

[0070] The microcontroller may utilize a time division multiplexingscheme that multiplexes temperature sensing and heating functions in theintegrated sensor/heater device such that the cell may generally be keptat a constant temperature. A calibration process characterizes theprofile of the cell and generates a polynomial regression formula thatprovides the optimal voltage drive output for given temperature and cellstate inputs. The microcontroller 402 stores the state of the liquidcrystal cell, the regression formula, and reads the temperature of theliquid crystal cell to compute and assert the temperature compensatedvoltage drive.

[0071]FIG. 11 shows a calibration process that may be used to performthe method of the present invention in which a liquid crystal cellthermal operating characteristic profile is translated intodeterministic coefficients assembled into a stored regression formulaused to adjust the voltage drive to the cell in response to temperatureand cell state.

[0072] The first step to determine the coefficient values in the cell'stemperature and voltage compensation profile, is to profile the liquidcrystal cell drive characteristics across a range of temperatures. Theprofile process step 601 may examine a light source passing through thecell and its attenuation at a given voltage and temperature combination.An operational liquid crystal cell is placed in a thermal chamberprogrammed to change operating temperature across the desiredtemperature range at a given interval. At every temperature changeinterval, a range of voltages are provided to the liquid crystal cellwhile a performance characteristic, such as attenuation, is measured.Voltage is scanned until reference attenuation levels are achieved, atwhich point the voltage, attenuation and temperature levels are storedas a grid reference in a cell profile definition table. The performanceof the liquid crystal cell is recorded at grid point attenuation andtemperature levels, resulting in a multi dimensional lookup tablewhereby any temperature and voltage input provides an attenuation leveloutput. This table may be represented as a three dimensional surface.

[0073] Step two requires processing the lookup table to smooth thevoltage profile over temperature at the given attenuation levels asrecorded in the previous step. A statistical program capable ofperforming regression analysis, such as Mathematica® may be used toperform this process step 602. The regression software is provided withthe look up table generated in step one, and performs a fourth orderregression curve fitting process that generates for each attenuationlevel, the appropriate coefficients a,b,c,d, and e representing avoltage versus temperature profile of the cell at each attenuationlevel, represented by the following formula,

v=a+bT+cT ² +dT ³ +eT ⁴

v ₁ =a ₁ +b ₁ T+c ₁ T ² +d ₁ T ³ +e ₁ T ⁴

v ₂ =a ₂ +b ₂ T+c ₂ T ² +d ₂ T ³ +e ₂ T ⁴

[0074] •

[0075] •

[0076] •

v _(n) =a _(n) +b _(n) T+c _(n) T ² +dT ³ +e _(n) T ⁴

[0077] where V=voltage, T=liquid crystal cell temperature,a,b,c,d,e=curve fit coefficients, and n=attenuation level.

[0078] Given that smooth curves result from the prior step that definethe optimal voltage drive level for a given temperature at the recordedgrid attenuation level, step three results in smooth curve regressionsfit across orthogonal axis of the three dimensional surface, whereby thesmooth curves are fit over the coarse attenuation grid recorded in step1. In this process step 603, the five coefficients of the previous stepare each solved by a second order regression. Specifically, Mathematica®or any suitable program is used to solve for the three coefficients thatfit the profile of each of the five coefficients a,b,c,d and e acrossall of the orders of the regressionv_(n)=a_(n)+b_(n)T+c_(n)T²+d_(n)T³+e_(n)T⁴. So, a smooth surface profiledefines the optimum voltage compensation level given an inputattenuation state and temperature by the following formula

v=a+bT+cT ² +dT ³ +eT ⁴, where,

[0079] a=(X+Yθ+Zθ²)

[0080] b=(X₁+Y₁θ+Z₁θ²)

[0081] c=(X₂+Y₂θ+Z₂θ²)

[0082] d (X₃+Y₃θ+Z₃θ²)

[0083] e=(X₄+Y₄θ+Z₄θ²)

[0084] Theta=liquid crystal attenuation level

[0085] X,Y,Z=solution to zero order coefficient

[0086] X₁,Y₁,Z₁=solutions to first order coefficient

[0087] X₂,Y₂,Z₂=solutions to second order coefficient

[0088] X₃,Y₃,Z₃=solutions to third order coefficient

[0089] X₄,Y₄,Z₄=solutions to fourth order coefficient

[0090] The fifteen coefficient solutions (Xn,Yn,Zn) where n=0 to 4, maybe generated by Mathematica, using the Fit(data, {1, x,x{circumflex over( )}2, . . . ,x{circumflex over ( )}n},x) function or other suitablesoftware packages capable of performing curve fitting regression.

[0091] Step four is the final step in the calibration process of FIG.11, process 606, and results in storing the coefficients in the liquidcrystal control system which is now described.

[0092] The coefficients that profile the liquid crystal characteristicsmay be stored in microcontroller 402 memory (FIG. 12) by flashing thememory of the microcontroller with the appropriate 15 coefficientvalues.

[0093] The thermal compensation system of the present invention operatesby reading the temperature of the liquid crystal cell and adjusting thevoltage drive of the cell based on the cell state. The cell state maytypically be OFF, ON or operate in a variable mode. The cell state maybe stored in the microcontroller 402 and also be configured via the hostcomputer 400.

[0094] Microcontroller may be a PIC microchip having an internal analogdigital converter and operating with a 10 Mhz crystal oscillator 404clock. The microcontroller may be connected to a digital analogconverter (DAC) configured to provide an output voltage level inresponse to a configuration pulse stream from the microcontroller over aserial interface. The output of the DAC connects to the input of ananalog switch 414 which is clocked by a port pin of the microcontrollerat approximately 1.2 khz. DATA passed to the DAC defines the amplitudeof an AM transmission over a 1.2 khz carrier that produces adifferential voltage drive to the liquid crystal cell electrodes 500 and500′ (FIG. 10B).

[0095] A temperature sensor reading may be provided by the internalintegrated heater/temperature sensor from an external device. One of theheater/temperature sensor electrodes 502 or 502′ of the liquid crystalcell 100 may be grounded while the other may connect to switch 407.Switch 407 may selectively engage the integrated heater/temperaturesensor element 108 in a sense or heat mode. More specifically, switch407 may be configured ON to connect the ungrounded heater/temperatureelectrode through instrumentation amplifier 406 to an ADC coupled to themicrocontroller which reads the temperature on the liquid crystal cell,or it may be configured OFF so that power amplifier FET 410, which maybe controlled by a pulse train from microcontroller 402 and applies avoltage potential to operate the device 108 as a heater.

[0096] In a temperature sense feedback closed loop operation, whichshall hereby be referred to as the loop embraced by process steps 607through 609 of FIG. 11, the microcontroller reads the temperature of theliquid crystal cell and calculates the voltage drive based on the sensedtemperature, T, and the current state of the liquid crystal cell, Theta.The fifteen coefficients are plugged back into the fourth orderregression formula to establish a smooth surface profile delineating anoptimal voltage to supply to liquid crystal cell for a given temperatureand cell attenuation level:

v=(X+Yθ+Zθ ²)+(X ₁ +Y _(1θ) +Z ₁θ²)T+(X ₂ +Y ₂ θ+Z ₂θ²)T ²+(X ₃ +Y ₃ θ+Z₃θ²)T ³+(X ₄ +Y ₄ θ+Z ₄θ²)T ⁴

[0097] The new voltage value V is computed and transmitted to the DAC412 which supplies the appropriate amplitude DC voltage into the clockedanalog switch 414 to produce the temperature compensated AM voltagedrive to the liquid crystal cell.

[0098] The liquid crystal cell may also be maintained about a referencetemperature. Process step 609 with respect to FIG. 11 involves theapplication of heat to maintain the temperature of the liquid crystalcell about a reference temperature. The reference temperature may beabove the ambient room temperature or above the temperature of anycarrier device that may be coupled to the LC cell. The selection of areference temperature above the ambient temperature will result in thetendency of the LC cell to cool to meet the ambient temperature afterthe application of a heat burst. A counter thermal bias is thereforegenerated to support temperature-stability about the referencetemperature.

[0099] Microcontroller memory may store the reference temperature, thevalue of the current temperature, historical temperatures, and,historical levels of heat applied to the LC cell. The value of thesensed temperature T at every instance may be compared against thereference temperature to determine the amount of heat to apply to theliquid crystal cell. An 8 bit analog digital converter will provideapproximately {fraction (1/3)} of a degree of temperature sensingresolution over the desired temperature range, so the example system mayprovide for temperature stability about a reference temperature towithin ⅓ degree Celsius. At every instance of process step 609, athreshold detector routine stored in microcontroller ROM may trigger acontrol function if the sensed temperature of the liquid crystal cellfalls below the desired operating reference temperature. The controlfunction may determine how much heat to apply to the liquid crystalcell. The control function may utilize error minimizing routines thattrack the change in temperature across multiple instances of processstep 609. The error correcting routines may store the previoustemperature reading T0 along with the previous amount of heat applied tothe liquid crystal cell H0. The temperature reading and every succeedingtemperature reading T1 may be compared against T0 to determine theamount of temperature change resulting from the previous heating of theliquid crystal cell. Heat may be applied to the liquid crystal cell byway of the FET power driver as described above. The heater may betriggered at a fixed or variable duty cycle and controlled usingfrequency or amplitude modulation.

[0100] Although the present invention has been fully described by way ofdescription and accompanying drawings, it is to be noted that variouschanges and modifications will be apparent to those skilled in the art.For example, various patterns may be used to form the spacer element,metal gasket and integrated heater/temperature sensor elements of thebasic cell platform. Use of external temperature sensors and heaters inpart or whole may be applied using the temperature compensation methodsand regression of the present invention. The metal gasket may bemodulated to provide heating function in addition to its function as amoisture barrier support membrane. Epoxy gaskets may be used incombination with metal gasket elements in part or whole, and the metalgasket elements may comprise a single solder cap. Anchoring and aligningthe liquid crystal material in a cell may also be performed using photoalignment material, Staralign by Vantio of Switzerland or or other knownalignment methods, including laser etching.

[0101] Anchoring the liqiud crystal material in the cell (describedhereunder as step five) may be performmed before patterning of thepolyimide (describedc hereunder as step four). The process steps for theclosed loop temperature feedback may also be rearranged such that theheating process is performed prior to applying the voltage drive. Theorder of fitting voltage with each dimension of the three dimensionalsurface is reversable and other three dimensional surface fittingalgorithms may be used, including but not limited to those that describea surface with one dimension fitting a fourth degree polynomial and theother dimension fitting a second degree polynomial. Amplitude orfrequency modulation may be used to drive the liquid crystal cell. Thefourth embodiment of this invention may be configured with theintegrated temperature sensor/heating element of the third embodiment ofthe present invention. The liquid crystal cell may not be limited to asingle pixel. The liquid crystal cell may be comprised of multiplepixels. Arrays of liquid crystal cells may be formed, including arraysof cells having one or more pixels. Therefore, it is to be noted thatvarious changes and modifications from those abstractions definedherein, unless otherwise stated or departing from the scope of thepresent invention, should be construed as being included therein andcaptured hereunder with respect to the claims.

1. A method of fabricating a liquid crystal cell, comprising the stepsof: a) providing first and second substrate material, b) depositingelectrode layers on first and second substrates, c) depositing alignmentlayers on first and second substrates, d) anchoring the alignmentlayers, e) depositing a spacer element on the first and secondsubstrates, and f) depositing a metal gasket element on the first andsecond substrates.
 2. The method of claim 1, further including thesteps: g) aligning and pressing the wafers together
 3. The method ofclaim 2 wherein step G is performmed using interlocking alignmentfeatures.
 4. The method of claim 2, further including the steps: h)dicing, i) scoring the die to form a ledge, j) removing the ledge fromeach die, and k) filling the liquid crystal with liquid crystalmaterial.
 5. The method of claim 3, wherein the interlocking alignmentfeatures are deposited on each substrate in step E or F.